2018 IEEE 68th Electronic Components and Technology Conference

来源:ECTC

[基本信息]

会议名称:2018 IEEE 68th Electronic Components and Technology Conference

开始日期:2018-05-29

结束日期:2018-06-01

所在国家:USA

所在城市:San Diego, California

具体地点:USA San Diego, California Sheraton San Diego Hotel & Marina

[重要日期]

摘要截稿日期:2017-10-09

[会务组联系方式]

联系人:Wolfgang Sauter

联系电话:+1-802-922-3083

E-MAIL:wolfgang.sauter@globalfoundries.com

会议网站:http://www.ectc.net/

[会议背景介绍]

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2018 ECTC will be held at The Sheraton San Diego Hotel & Marina, San Diego, California, USA, during May 29 – June 1, 2018, featuring about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors.

The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, optoelectronics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.

The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies.

The Panel Discussion, Plenary Session, and CPMT Seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.

The Technology Corner complements the Technical Program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.

The ECTC would not be possible without the sponsorship of the IEEE Electronics Packaging Society (formerly CPMT), numerous corporate participants and sponsors, and the time and energy of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.

[征文范围及要求]

On this page are directions for preparing and submitting your ECTC 2018 paper and presentation. This year the proceedings will be published by the IEEE Computer Society Conference Publishing Service.

If we have omitted anything, please send your inquiries to Program Chair Chris Bower.

The complete paper preparation guidelines and paper submission instructions are located at https://ieeecps.org/#!/auth/login?ak=1&pid=2qOlmCkjsWTBrntMbXrG1S.

ECTC asks that you please email your papers to your session chairs for review at the time of submission. One of the responsibilities of the ECTC session chairs is to review and provide valuable feedback to our authors with the goal of having the highest quality conference proceedings.

Use your original ECTC abstract ID for the “Paper ID” when submitting the final paper PDF.

Be aware that you are required to submit the copyright release form.

No commercial content should appear in ECTC papers.

Your paper will be processed through IEEE’s plagiarism check software to identify and eliminate plagiarism. This includes excessive self-duplication and dependence on earlier published works, as well as duplicated and unattributed content. ECTC asks that your paper’s content be original, previously unpublished, non-confidential and without commercial content.

When submitting the final paper, the “Abstract” section should be the abstract from the manuscript, not the original abstract submitted for acceptance into the conference.

ECTC recommends paper length of 6 to 8 pages for publication in the conference proceedings. The maximum allowed length is 12 pages.

Your paper must be formatted according to the IEEE Computer Society Proceedings Manuscript Formatting Guidelines included at the link provided above.

The paper submission due date is February 23, 2018.

Examples of well received papers are the Best Papers from the past ECTC. (Please note that the paper format template is changing this year.)

Presentation Template for Microsoft PowerPoint will be provided soon.

Interactive Presentation Information and Quad Chart Template for Microsoft PowerPoint will be provided soon.

Visa Reminder (PDF)

Calendar - Last day for ECTC rate hotel registration: May 4, 2018, and last day for discounted conference registration: May 3, 2018.